Job Description

Huntington Ingalls Industries - Mission Technologies division is seeking a highly skilled and motivated CCA Board Design Engineer 3 to join our growing engineering team. In this role, you will be responsible for the PCB design and layout of complex, high-reliability Circuit Card Assemblies (CCAs) and Printed Circuit Boards (PCBs) utilized in cutting-edge defense, national security, and electronic warfare systems.

​As a Level 3 engineer, you will act as a technical lead on complex design tasks, collaborating closely with systems, mechanical, thermal, and software engineers to deliver robust hardware solutions from conceptual design through production.

Essential Job Responsibilities

• Full Lifecycle Design: Lead layout design of complex multi-layer, high-speed digital, analog, and mixed-signal CCAs, as well as assist in schematic capture and documentation.
• ​Technical Leadership: Guide junior engineers and design layout specialists through complex routing challenges, high-speed signaling constraints, and power distribution network (PDN) design.
• ​DFx Optimization: Apply Design for Manufacturing (DFM), Design for Testing (DFT), and Design for Assembly (DFA) principles to ensure seamless transition from design to full-scale production.
• ​Cross-Functional Collaboration: Partner with Mechanical and Thermal Engineers to ensure proper physical integration, structural integrity, and thermal dissipation of the CCAs within rugged environments.
• ​Documentation: Generate comprehensive engineering documentation packages, including schematics, bills of materials (BOMs), fabrication drawings, and assembly instructions.

Minimum Qualifications

• Education & Experience: Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related STEM field with a minimum of 5 years of relevant experience; OR a Master’s degree with 3 years of relevant experience.
• ​EDA Tool Proficiency: Demonstrated expert-level experience with industry-standard PCB design suites (e.g., Altium Designer, Siemens EDA/Mentor Graphics Xpedition, or Cadence Allegro).
• ​Technical Expertise: Strong background in designing multi-layer boards utilizing high-density interconnect (HDI) microvias, controlled impedance, and fine-pitch BGA components.
• ​Component Knowledge: Proven experience selecting components and designing circuits featuring FPGAs, processors, high-speed memory interfaces, and power management units (PMUs).

Preferred Requirements

• Active Secret clearance.
• ​Familiarity with aerospace/defense standards such as MIL-STD-810, IPC-2221/2222, and IPC-A-610.
• ​Experience with RF/Microwave board layout and isolation techniques.
• Familiarity with Altium Designer and Altium component and project databases
• ​Experience utilizing simulation tools like HyperLynx, Ansys HFSS, or Keysight ADS for Signal Integrity and Power Integrity analysis.
• ​Strong written and verbal communication skills, with the ability to present technical design reviews (PDR/CDR) to internal management and external clients.