Company:

Boeing Defense, Space & Security (BDS) seeks an Electrical Design Engineer to join the Electrical Engineering Capability Team in Huntsville, Alabama.  This team designs, sustains, and upgrades next generation electronics concepts, and supports production and special test equipment design for increasing capacity requirements.

Position Responsibilities:

• High speed digital circuit and signal integrity analysis.
• Focus on electrical design, simulation, verification testing, and validation testing of high-speed printed circuit board (PCB) design and electronic systems.  Provide design guidelines and support for system architecture design, board layout, product bring-up, debug, validation, and factory builds.
• Circuit board design for engineering and operational systems through product development cycles.
• Integrate designs with hardware and software components and systems.
• Review testing and analysis activities to assure compliance to requirements.
• Support Root Cause/Corrective Action (RCCA) investigations, troubleshooting, and resolutions.

To meet security standards and protocols, all work is performed onsite in Huntsville, AL.

This position requires the ability to obtain a U.S. Security Clearance for which the U.S. Government requires U.S. Citizenship.  An interim or final U.S. Secret Clearance Post-Start is required.

Basic Qualifications (Required Skills/Experience):

• 1 years of related work experience for level 2.
• 3 years of related work experience for level 3.
• Experience in digital circuit design or Printed Circuit Board (PCB) design.
• Bachelor of Science degree from an accredited course of study in engineering, engineering technology (including manufacturing engineering technology), chemistry, physics, mathematics, data science, or computer science.

Preferred Qualifications (Desired Skills/Experience):

• Bachelor of Science degree or higher in Electrical Engineering or Computer Engineering.
• Understanding of digital circuit card design and analog circuit card design and analysis.
• Experience in high-speed digital circuit design with ability to perform signal integrity simulations for multiple high-speed standards like 100G Ethernet, DDR2/3/4, PCIe.
• Ability to generate board layout requirements to meet design performance and design for manufacture (DFM) requirements.
• Ability to develop design verification plans and perform system integration.
• Experience in processor board design, complex digital design including processor, FPGA System on Chip (SOC).
• Experience performing circuit analysis in SPICE or similar tools like LTSpice etc.
• Familiarity with high-speed serial interface protocol like ethernet, PCIe.
• FPGA sizing and power to support board design experience.
• Strong understanding of PCB in design for manufacturing (DFM).
• Experience performing digital high speed design verification and validation including measurements.
• Experience using Siemen (formally Mentor Graphic) Expedition Tool.
• FPGA design experience.

Typical Education & Experience:

Level 2: Education/experience typically acquired through advanced technical education from an accredited course of study in engineering, engineering technology (includes manufacturing engineering technology), computer science, engineering data science, mathematics, physics or chemistry (e.g. Bachelor) and typically 2 or more years' related work experience or an equivalent combination of technical education and experience or non-US equivalent qualifications. In the USA, ABET accreditation is the preferred, although not required, accreditation standard.

Level 3: Education/experience typically acquired through advanced technical education from an accredited course of study in engineering, computer science, mathematics, physics or chemistry (e.g. Bachelor) and typically 5 or more years' related work experience or an equivalent combination of technical education and experience (e.g. PhD, Master 3 years' related work experience). In the USA, ABET accreditation is the preferred, although not required, accreditation standard.

Relocation:

This position offers relocation based on candidate eligibility.

Drug Free Workplace:

Boeing is a Drug Free Workplace where post offer applicants and employees are subject to testing for marijuana, cocaine, opioids, amphetamines, PCP, and alcohol when criteria is met as outlined in our policies

Pay and Benefits:

At Boeing, we strive to deliver a Total Rewards package that will attract, engage and retain the top talent. Elements of the Total Rewards package include competitive base pay and variable compensation opportunities.

The Boeing Company also provides eligible employees with an opportunity to enroll in a variety of benefit programs, generally including health insurance, flexible spending accounts, health savings accounts, retirement savings plans, life and disability insurance programs, and a number of programs that provide for both paid and unpaid time away from work.

The specific programs and options available to any given employee may vary depending on eligibility factors such as geographic location, date of hire, and the applicability of collective bargaining agreements.

Pay is based upon candidate experience and qualifications, as well as market and business considerations.

Summary Pay Range:

Level 2: $88,400 to $119,600

Level 3: $107,100 to $144,900

Language Requirements:

Education:

Relocation:

Export Control Requirement:

Safety Sensitive:

Security Clearance:

Visa Sponsorship:

Contingent Upon Award Program

Shift:

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