One team. Global challenges. Infinite opportunities. At Viasat, we’re on a mission to deliver connections with the capacity to change the world. For more than 35 years, Viasat has helped shape how consumers, businesses, governments and militaries around the globe communicate. We’re looking for people who think big, act fearlessly, and create an inclusive environment that drives positive impact to join our team.

Viasat is looking for a dynamic Mechanical Design Engineer to join our growing team.  In this exciting role, you will be responsible for the design, documentation, and testing of electronics hardware.

The day to day work encompasses electronics packaging, cabling, thermal analysis down to the component junction level, structural analysis, and qualification testing.  You will ensure the design has the proper parts, materials and interface design so each module operates as intended within its environmental and performance requirements.  You will work directly with a diverse staff including engineering, configuration managment, supply chain, manufacturing, and quality assurance to manage the product development. 

• 5 to 10 years of experience in Mechanical Design Engineering including development of electronics packaging, ruggedized products, and cryptographic equipment.

• Design experience creating 3D parts and assemblies using SolidWorks.

• Experience in creating and analyzing models in thermal analysis software (Ansys, Thermal Desktop, SolidWorks Flow Sim or similar).

• Experience performing thermal analysis of electronics components down to the junction level and managing heat dissipation within electronics assemblies.

• Experience designing ruggedized products for harsh environments. 

• Experience working as part of a diverse team of multiple disciplines.

• Ability to manage, allocate, and derive requirements, familiarity with MIL-STD-810 environmental testing and similar MIL standards.

• Ability to create specifications and presentations.

• Proficiency in MS Word, Excel, and Power Point.

• Strong communication skills - both verbal and written.

• Bachelor of Science in Mechanical Engineering or a similar relevant engineering degree.

• U.S. Citizenship Required.

• Ability to obtain a U.S. Secret Clearance.

• Up to 10% of domestic travel.

• Cryptographic electronics packaging experience using SolidWorks.

• Active U.S Secret Clearance.

• Electronics packaging experience using SolidWorks.

• Thermal Analysis experience for electronic modules.

• Master of Science degree in Mechanical Engineering.

Viasat is proud to be an equal opportunity employer, seeking to create a welcoming and diverse environment. All qualified applicants will receive consideration for employment without regard to race, color, religion, gender, gender identity or expression, sexual orientation, national origin, ancestry, physical or mental disability, medical condition, marital status, genetics, age, or veteran status or any other applicable legally protected status or characteristic. If you would like to request an accommodation on the basis of disability for completing this on-line application, please click careers@viasat.com" rel="noopener" target="_blank">here.

The day to day work encompasses electronics packaging, cabling, thermal analysis down to the component junction level, structural analysis, and qualification testing.  You will ensure the design has the proper parts, materials and interface design so each module operates as intended within its environmental and performance requirements.  You will work directly with a diverse staff including engineering, configuration managment, supply chain, manufacturing, and quality assurance to manage the product development. 

• 5 to 10 years of experience in Mechanical Design Engineering including development of electronics packaging, ruggedized products, and cryptographic equipment.

• Design experience creating 3D parts and assemblies using SolidWorks.

• Experience in creating and analyzing models in thermal analysis software (Ansys, Thermal Desktop, SolidWorks Flow Sim or similar).

• Experience performing thermal analysis of electronics components down to the junction level and managing heat dissipation within electronics assemblies.

• Experience designing ruggedized products for harsh environments. 

• Experience working as part of a diverse team of multiple disciplines.

• Ability to manage, allocate, and derive requirements, familiarity with MIL-STD-810 environmental testing and similar MIL standards.

• Ability to create specifications and presentations.

• Proficiency in MS Word, Excel, and Power Point.

• Strong communication skills - both verbal and written.

• Bachelor of Science in Mechanical Engineering or a similar relevant engineering degree.

• U.S. Citizenship Required.

• Ability to obtain a U.S. Secret Clearance.

• Up to 10% of domestic travel.